| PART |
Description |
Maker |
| M6MGE13VW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGB64BS8BWG M6MGT64BS8BWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGE13VW34DWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| AN1235 |
FLIP-CHIP CSP: PACKAGE DESCRIPTION AND RECOMMENDATIONS FOR USE
|
SGS Thomson Microelectronics
|
| ADF4602BCPZ-RL |
Single-Chip, Multiband 3G Femtocell Transceiver; Package: LFCSP: Leadform Chip Scale; No of Pins: 40; Temperature Range: Ind TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, QCC40
|
Analog Devices, Inc.
|
| ADG758 ADG759 ADG759BCP ADG758BCP |
3 OHM, 4-/8-CHANNEL MULTIPLEXERS IN CHIP SCALE PACKAGE
|
AD[Analog Devices]
|
| FCSP130LTR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| FCSP1H40ETR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| FCSP140TR |
Chip Scale Package Schottky Barrier Rectifier
|
Vishay Siliconix
|
| PACDN1408CR PACDN1404CR PACDN1404C PACDN1404 PACDN |
ESD PROTECTION ARRAYS CHIP SCALE PACKAGE
ESD PROTECTION ARRAYS, CHIP SCALE PACKAGE
ESD PROTECTION ARRAYS/ CHIP SCALE PACKAGE
|
CALMIRCO[California Micro Devices Corp]
|
